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Computer Chip Thermal Silicone Heat Sink High Temperature LED Insulation Gasket Fire Thermal Conductive Silicone Chip

Computer Chip Thermal Silicone Heat Sink High Temperature LED Insulation Gasket Fire Thermal Conductive Silicone Chip

Overview High performance thermal conductive silicone pad for new energy GC-TP-100ACompany Profile We are Dongguan Gold-
Overview
Basic Info.
Model NO. GC-TP-100A
Classification Thermal Pad
Certification ISO9001
Color Pink
Brand Gold-Cool
Heat Sink Pad Solid Silicone Grease
High Thermal Conductivity CPU Heat Sink
Thermal Conductive Silicone Pad Heat Conduction Material
Transport Package Shipping/Rail/Express
Specification 210*410mm/320*320mm/Customizable shapes patterns
Trademark Gold-cool
Origin China
HS Code 3284999999
Production Capacity 80000m2/Mon
Product Description
High performance thermal conductive silicone pad for new energy GC-TP-100ACompany Profile

We are Dongguan Gold-cool Nano Technology Co., Ltd., a company specialized in the research, production and sales of thermal conductive materials. Our main products include thermal conductive silicone pads, thermal conductive silicone grease, thermal conductive gel, etc. Our company is customer-oriented, providing high-quality products and customized solutions, fully meeting the needs of various industries for thermal conductive materials. Our products are widely used in various fields such as electronic products, telecommunications equipment, household appliances, LED lighting, automotive electronics, etc. Thermal conductive materials can effectively solve the heat dissipation problems caused by high temperatures during the use of these devices, extending the service life of the equipment and enhancing its stability. Our company has a presence across mainland China, Taiwan, Shanghai, and other regions. No matter where our customers are, we can provide timely, professional technical support and excellent after-sales service.Dongguan Gold-cool Nano Technology Co., Ltd. is committed to technological innovation, the pursuit of excellent quality, and providing customers with the best thermal solutions. We firmly believe that only by focusing on customers, combining excellent products with thoughtful services, can we win the market and achieve success. We look forward to cooperating with you to create a better future.

Product Description

Product Presentation:

No matter use what kind of cooling device,if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components , the cooling device will not be able to effectively reduce the heat of electronic components.This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment. Feature:1,Good thermal performance.2,Soft and high compressibility, vibration shock absorber.3,Self-adhesive.4,,Easy construction.5, Electrical insulation6, Complies ROHS and UL environmental requirements.7, Provide a variety of thickness to choose. Application area:Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone.Product Parameters
Typical Properties:
ProjectUnitGC-TP-100ATesting Standard
Color-Grey Visual
Reinforcement Carrier-None-
Thicknessmm0.3~13ASTM D374
Realse Liner-PET/Film/PE/other-
Sizemm200*400/320*320-
HardessShore oo25°-75°ASTM D2240
Thermal ConductiveW/m.k1.0ASTM D5470
Densityg/cm32.0ASTM D792
Thermogravimetric Loss%<1.0@150ºC/24H
Tensile StrengthMPa0.32ASTM D412
Volume ResistivityΩ.cm1.0*1013ASTM D257
Dielectric StrengthKV/mm>6ASTM D149
Flame Rating-V-0UL94
Temperature RangeºC-40~200-
Detailed Photos
Thermal pad has major advantage is its superior thermal conductivity, effectively transferring heat from the source to the cooling device, thus enhancing the cooling efficiency of equipment.Moreover, In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution. Our thermal pad to be widely applied in various fields, including new energy, energy storage, medical, power supply, inverter industries.Our Advantages

Computer Chip Thermal Silicone Heat Sink High Temperature LED Insulation Gasket Fire Thermal Conductive Silicone Chip